Samsung introduces flip-chip mid-and high-power LEDs and COB module

Delivering on a new LED architecture first disclosed at the February Strategies in Light (SIL) conference in Santa Clara, California, Samsung has announced the LM131A mid-power LED family and the LH141A high-power LED family based on a flip-chip device architecture. The company also announced a new flip chip on module (FCOM) product that utilizes the new LEDs and that is designed for use in downlight applications. Meanwhile, the company also recently announced a large solid-state lighting (SSL) module family designed for planar lighting applications.