Samsung innovates further in LED chip packaging to save cost and increase light

Samsung has improved its chip scale LED packages by compacting even smaller to a dimension of 1.2 mm by 1.2 mm, compared to its previous 1.4 mm by 1.4 mm measuring Chip Scale Packaging (CSP) LEDs. Samsung uses CSP to save another packaging process after the actual LED chip manufacturing. While this is saving in production of LED itself, there are other benefits by using CSP LEDs such as lower thermal resistance and high current availability, resulting in high light intensity and improved reliability.