Refond Launches Industry-First Diamond-based Ultra-high Power Density Packaging
In complex application scenarios, high-power LEDs face issues such as accelerated light decay and reduced stability caused by poor heat dissipation, which have become urgent challenges for the industry.
To address the pain points of traditional high-power packaging products, Refond has innovatively adopted diamond-based substrate technology, launching a groundbreaking high-power packaging product—Diamond-based Ultra-high Power Density Packaging. This product meets the demand for high-power LEDs in scenarios such as automotive headlights, outdoor high-intensity lighting, and stage lighting, opening up more possibilities for the development and application of high-power LEDs.
In high-power application scenarios such as automotive headlights, conventional ceramic materials often suffer from severe light decay, shortened lifespan, or even burnout due to poor heat dissipation. Refond has innovatively adopted a diamond-based substrate, with a thermal conductivity of up to 1800W/(m·K), which is 10 times that of ceramic materials. This enables continuous brightness improvement under high power while ensuring the LED chip operates stably at higher power levels.
The new product offers a variety of specifications, with the smallest single-lamp size measuring just 5*5mm. It is fully compatible with mainstream market standards, allowing direct replacement of existing solutions, effectively reducing maintenance costs. It meets the requirements of various high-efficiency application scenarios, especially suitable for situations requiring high brightness and long-term illumination, such as streetlights.
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