'Soft-touch' approach advances nondestructive testing for micro-LED wafers

Tianjin University researchers have unveiled a groundbreaking nondestructive testing method for micro-LED wafers, using what they call a "soft-touch" approach. This innovation addresses a long-standing challenge in the micro-LED industry: how to test delicate wafers without damaging them.

The team, led by Professor Huang Xian, developed a flexible 3D probe array that gently conforms to the wafer’s microscopic surface. Applying just 0.9 MPa of pressure—about as soft as a breath—these probes can perform high-throughput electrical testing without scratching or degrading the wafer. Impressively, the probes maintain their integrity even after one million uses.

To complement the probes, the researchers also created a custom measurement system, forming a complete solution for quality control and yield screening. This method not only improves testing efficiency but also extends the lifespan of the testing equipment.
Currently moving toward commercialization at the Tiankai Higher Education Innovation Park, this technology could reshape how micro-LEDs are inspected and pave the way for broader applications in flexible electronics and biophotonics. 
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