Indium Corporation Introduces AuSn Pastes for High-Power LEDs

Indium Corporation has expanded its portfolio of proven pastes with two new AuSn pastes designed for the higher processing temperatures and assembly needs required for use in high-power LED module array applications, such as automotive, infrastructure, and horticulture.

Indium Corporation produces a wide range of solder paste products to meet the current and evolving needs of the industry. High-power LEDs have the ability to provide much higher levels of light output than traditional LEDs while also providing higher levels of performance, leading to a longer lifetime of the device. Due to the large amount of heat generated—in such a localized area—a high-melting and high-reliability solder is required for assembly.

Both pastes are offered in a variety of AuSn alloys and powder sizes. In addition to being ideal for use in high-power LED module array applications, AuLTRA™ 3.2 and AuLTRA™ 5.1 are applicable for all AuSn paste applications as their performance has been, and continues to be, proven in the field.