3D-Micromac Receives Order for Multiple Laser Lift-Off Systems for microLED Device Manufacturing

An optical solutions provider has purchased multiple microMIRA Laser Lift-Off (LLO) systems from 3D-Micromac for use in the production of microLED devices. The customer will install the new microMIRA systems in pilot- and production lines at its state-of-the-art LED chip factory in Asia.

The microMIRA laser system from 3D-Micromac provides highly uniform, force-free lift-off of different layers on large-area substrates at high processing speeds without the need for costly and polluting wet chemical processes.

The system is capable of processing different substrate materials and sizes, and can achieve processing speeds (including handling) of up to 60 eight-inch wafers per hour.

MicroLEDs have the potential to revolutionize the display industry, promising a variety of advantages such as superior viewing angle, high dynamic range with perfect black luminance and high brightness, wide color gamut, fast refresh rates, long lifetime, and low power consumption. Potential applications include very large displays for indoor and outdoor use, as well as high-resolution displays for augmented reality (AR) and virtual reality (VR) wearable devices.