Avicena Launches the World’s First microLED Optical Interconnect Evaluation Kit for AI Infrastructure Innovators

Avicena announced the LightBundle eKit, the industry’s first evaluation platform for microLED optical connectivity using ASIC-based transceivers with integrated LED, photodetector (PD) and micro-lens arrays connected via a multi-core fiber bundle. The kit enables hyperscaler, AI accelerator, high-bandwidth memory (HBM), networking, and AI infrastructure architects to evaluate next-generation optical links designed to overcome the bandwidth, reach, routing and energy limitations of copper interconnects in AI systems.

As AI clusters scale to tens of thousands of AI accelerators (XPUs), interconnect bandwidth and power consumption emerge as critical bottlenecks. MicroLED optical interconnects provide a new approach that offers longer reach at higher bandwidths compared to copper interconnects while eliminating lasers entirely, enabling low energy per bit, increasing reliability even at elevated temperatures and delivering terabit-per-millimeter bandwidth density.

LightBundle eKit provides system designers with a practical platform to evaluate microLED technology for AI scale-in (die-to-die and die-to-memory connectivity) and scale-up (XPU-to-XPU and XPU-to-switch connectivity) architectures.

AI training and inference clusters depend on thousands of high-bandwidth links connecting accelerators, memory, and switch fabrics. As these interconnect bandwidths approach the multi-terabits per second phase, traditional copper interconnects reach physical limits in reach, routing and power efficiency.

At the same time, conventional optical technologies based on lasers and silicon photonics introduce reliability challenges, higher power consumption, and thermal sensitivity.

MicroLED optical interconnects eliminate lasers entirely, enabling reliable low energy operation at elevated temperatures while delivering terabit-per-millimeter bandwidth density.