Verticle develops chemical dicing for low-cos mini-LEDs

Verticle has developed innovative die singulation technology called ‘Chemical Dicing’, which enables a reduction in mini-LED die size without chip damage. Using the chemical dicing process, dramatic cost reduction can be achieved through a substantial increase in die count per wafer.

One of the most effective ways to reduce the manufacturing cost would be to shrink die size. However, this is limited by current die singulation technologies (e.g. the industry-standard stealth laser dicing process) due to chip damage and extremely long processing time.