Rohinni Secures Chinese Patent Awards

Rohinni, a developer of advanced component placement solutions, announced four new Chinese patent claims related to high-speed placement processes have been awarded.

The patents cover the company’s newest placement technology which allows for the placement of semiconductor die at speeds greater than 100Hz with accuracy levels of <10µm. The new patents protect Rohinni’s complete solution that achieves a 33% improvement in placement speed, thus requiring 25% fewer machines to meet the projected 2025 demand with 12.6% lower total cost of ownership than leading competitive technology.

The granted claims provide a wide range of protection including the bondhead and needle transfer device, inspection technology and motion control. The awarded claims address the key pillars of Rohinni’s total solution which will be formally introduced later this year.