ams OSRAM plans to significantly expand production and chip technologies in Styria by 2030 as part of the European Chips Act

ams OSRAM is sustainably strengthening its development and production site in Premstätten. Aldo Kamper, CEO of ams-OSRAM AG, together with Federal Minister Martin Kocher and the Governor of Styria, Christoper Drexler, presented plans to invest a total of EUR 588 Mio. in the development and production site in Premstätten by 2030. Within the framework of the European Chips Act, funding of up to EUR 200 Mio. has been applied for.

This means that ams OSRAM's application for funding is already in pre-notification and has been submitted to the EU Commission for approval. The planned new factory at the production site in Styria is intended to further expand the leading role of the Austrian semiconductor industry. A total of 250 new jobs will be created in the next few years.

The global situation in the semiconductor market clearly shows the importance of investing in innovative key technologies for the future. This is why the European Commission has set itself the goal of promoting the mass production of semiconductors in Europe and increasing its global market share to 20 percent of production by 2030. In addition, new next-generation chip technologies are to be made possible. Therefore, the European Chips Act has been launched.

The investment by ams OSRAM will help strengthen European sovereignty in semiconductor production and digitization. It will also make an important contribution to the “Green Transition”.

As part of its strategic program ‘Re-establish the Base’, ams OSRAM is focusing on structural growth areas in its core business with intelligent sensors and emitters (LEDs and laser diodes for automotive, medical and industrial applications as well as highly differentiated components for consumer handhelds).

The planned semiconductor manufacturing facility, which will be the first of its kind in the world, will produce the next generation of highly differentiated optoelectronic sensors for medical and automotive applications. There are also plans to manufacture products for industrial and consumer goods applications. It consists of a combination of outstanding technologies (CMOS, Filter¹⁾ and TSV²⁾) functions according to a toolbox concept. Depending on the product, the different capabilities can be individually combined as required for energy-efficient products for imaging and optoelectronics with a reduced form factor, more functions on one component and outstanding electrical performance. The construction of an additional 1,800-square-meter cleanroom at the Premstätten site for CMOS production will also double filter capacity and increase TSV capacity by a factor of four.