Daktronics to Show Flip-Chip COB Product at InfoComm 2024
The latest in Flip-Chip COB (Chip On Board) LED technology will be showcased by Daktronics of Brookings, South Dakota, during InfoComm 2024, the largest pro-AV show in North America, taking place June 8-14 in Las Vegas, Nevada.
Daktronics will be set up in West Hall, Booth #W2617, with the 0.9-millimeter pixel pitch COB product creating a 7-foot-high by 12-foot-wide 4K screen on one side of the booth and two 0.9-millimeter COB displays on the other side of the booth – one with high frame rate and the other pure black contrast. The company’s latest Integrated Matrix Device (IMD) LED technology will also be in the booth, including a 1.2-millimeter floor display and a 0.7-millimeter display with a 110-inch diagonal size. A speed frame mounting demo rounds everything that can be seen at the Daktronics booth.
The line of products Daktronics offers with this COB technology ranges from 1.8 millimeters down to 0.9 millimeters. It brings less heat to the display face and removes the wire bonds to increase reliability. It also decreases the power consumption for a lower cost of ownership over time.
Daktronics will be set up in West Hall, Booth #W2617, with the 0.9-millimeter pixel pitch COB product creating a 7-foot-high by 12-foot-wide 4K screen on one side of the booth and two 0.9-millimeter COB displays on the other side of the booth – one with high frame rate and the other pure black contrast. The company’s latest Integrated Matrix Device (IMD) LED technology will also be in the booth, including a 1.2-millimeter floor display and a 0.7-millimeter display with a 110-inch diagonal size. A speed frame mounting demo rounds everything that can be seen at the Daktronics booth.
The line of products Daktronics offers with this COB technology ranges from 1.8 millimeters down to 0.9 millimeters. It brings less heat to the display face and removes the wire bonds to increase reliability. It also decreases the power consumption for a lower cost of ownership over time.
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