OMNIVISION Expands TheiaCel Product Portfolio with New 12MP-resolution Image Sensor for LED-Flicker-free Automotive Cameras
OMNIVISION, a leading global developer of semiconductor solutions, including advanced digital imaging, analog and touch & display technology, debuted its OX12A10 12-megapixel (MP)-resolution CMOS image sensor with TheiaCel technology at AutoSens Europe 2024. The new sensor improves automotive safety by providing enhanced resolution and image quality, regardless of lighting conditions. The OX12A10 is ideal for high-performance front machine vision cameras for advanced driver assistance systems (ADAS) and autonomous driving (AD).
The 12MP OX12A10 is the highest-resolution sensor in OMNIVISION’s 2.1-micron (µm) TheiaCel product family, which also includes the 8MP OX08D10 and 5MP OX05D10 devices. TheiaCel harnesses the capabilities of next-generation lateral overflow integration capacitors (LOFIC) and OMNIVISION’s DCG™ high dynamic range (HDR) technology to eliminate LED flicker regardless of lighting conditions. OMNIVISION’s TheiaCel™ solution also achieves a wider dynamic range than earlier automotive HDR architectures.
The OX12A10 has a 1/1.43-inch optical format and is the first image sensor to feature OMNIVISION’s a-CSP+™ package technology. At just 12450µm x 8100µm in size, it has a much more compact design than traditional ball grid array (BGA) packages.
The OX12A10 is available for sampling now and will be in mass production in Q3 2025.
The 12MP OX12A10 is the highest-resolution sensor in OMNIVISION’s 2.1-micron (µm) TheiaCel product family, which also includes the 8MP OX08D10 and 5MP OX05D10 devices. TheiaCel harnesses the capabilities of next-generation lateral overflow integration capacitors (LOFIC) and OMNIVISION’s DCG™ high dynamic range (HDR) technology to eliminate LED flicker regardless of lighting conditions. OMNIVISION’s TheiaCel™ solution also achieves a wider dynamic range than earlier automotive HDR architectures.
The OX12A10 has a 1/1.43-inch optical format and is the first image sensor to feature OMNIVISION’s a-CSP+™ package technology. At just 12450µm x 8100µm in size, it has a much more compact design than traditional ball grid array (BGA) packages.
The OX12A10 is available for sampling now and will be in mass production in Q3 2025.
No comments: